It was nearly a decade ago when Intel, then the undisputed leader in global semiconductor manufacturing, made a fateful decision.
A new technology, extreme lithography, was offering a way to pack more computing power on to the silicon wafers from which tiny chips, essential for widely used products like smartphones and PCs, are cut.
Using light to etch complicated integrated circuits, EUV promised an unparalleled degree of miniaturisation, but Intel executives believed it would take years for the method to become practical. Instead, they stuck with older manufacturing techniques for their next generation of chips.
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