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Intel to receive $8.5bn in US funding for high-end chip manufacturing
英特尔将获85亿美元政府融资以扩大高端芯片产能

Preliminary agreement under US Chips Act also includes $11bn loan as company expands capacity in Arizona and other states
这项根据《美国芯片法》达成的初步协议还包括110亿美元贷款,帮助英特尔扩大在亚利桑那州和其他州的产能。

Intel will receive $8.5bn in direct funding and $11bn in loans from the US government to expand its capacity to make high-end chips, as it seeks to reinvent itself as a national champion in the sector and compete with the likes of Taiwan’s TSMC and South Korea’s Samsung.  

英特尔(Intel)将从美国政府获得85亿美元的直接融资和110亿美元的贷款,以扩大其制造高端芯片的能力。该公司正寻求将自己重塑为该产业的国家冠军企业,并与台湾的台积电(TSMC)和韩国的三星(Samsung)等公司展开竞争。

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