When the US government moved in May 2019 to cut Huawei off from American chips, software and semiconductor manufacturing technology, most analysts saw it as a death sentence for the Chinese tech giant.
That night, He Tingbo, head of Huawei’s chip unit HiSilicon, circulated an internal letter calling the ban the “darkest of days”, but revealing that the company had spent almost a decade preparing for what she called an “extreme survival scenario”.
According to a copy of the letter seen by the FT, Huawei had developed backup chips across its product range in anticipation that foreign suppliers could one day be cut off.
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