Samsung’s $40bn investment into chipmaking in Texas announced on Monday includes a plan to build an “advanced chip packaging” facility, that will bring the US a big step closer to being able to manufacture cutting-edge artificial intelligence chips on home soil.
The Korean company’s move is seen as a major win for the Biden administration which, alongside China, has recognised advanced packaging’s growing importance in the semiconductor supply chain.
The world’s leading chipmakers are pouring billions of dollars into expanding and improving advanced packaging techniques, believing they will be crucial to improving the performance of semiconductors.
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